Special Panel: Co-Packaged Optics, Packaging and Challenges
Distinguished panelists:
John Knickerbocker (IBM)
Clint Schow (University of San Diego)
Vikas Gupta (Global Foundries)
David Harame (AIM Photonics)
Moderators:
John Mazurowski (Director, (ManTech) Electronics Manufacturing Center)
Abstract:
Needs, issues, and events are motivating industry to make co-packaged optics possible. An immediate need comes with supporting information processing using AI, which is driving the needs for electrical power and information processing efficiency. A common issue has been the expense of transmitting optical signals between platforms- fiber / bulk optics / micro-optics / integrated optics / waveguide. Recent events include the availability of optical functions in electronics foundry processes, quantum and neuromorphic computing, the capacity of graphics processing engines, and interconnections between domains provided by efforts in heterogeneous integration. Considering all of these, the definition of co-packaged optics depends on the domain. It is pleasing that industry participants are up to the challenge of making co-packaged optics their own.
Workshop: Lightning Talks
The Thursday afternoon will be given to a series of brief talks from companies / organizations to present who they are, what they research and how you can be a collaborator. We will have some exciting talks from:
Girish Wable: What is SMART USA and what is a digital twin, how you can be part of the ecosystem.
Scott Miller: Introdution to NextFlex and the world of flexible and hybrid electronics.
John Mazurowski: Introduction to the Penn State and their work in MANTEC
Dean Turnbaugh: How can NTVUSA help with your research and manufacturing challenges
Jobert von Eisen: Updates and challenges with copper plating in glass substrates